About FELA GmbH
The FELA GmbH is a medium-sized and group-independent manufacturer and distributor of printed circuit boards, assemblies and systems from southern Germany.
The company employs 130 people at two locations - production and administration in Villingen-Schwenningen and trade in Solingen. In 2018, a turnover of 27.1 million euros was generated. The company was purchased in 1998 through a management buyout from the Swiss FELA group of companies; all shareholders are actively involved in the company.
In order to expand its product portfolio and to secure its location in Germany, FELA is positioning itself broadly. Investments in the classic printed circuit board, the expansion of the product portfolio to include special technologies such as metal core printed circuit boards for heat-critical applications and intensive research & development into new processes are what set us apart.
The SYSTEMS business unit is responsible for the development and manufacture of switches, keypads and input systems on glass. The capacitive sensor technology used offers quite a few advantages over previously used components due to the properties of the material, and it also has a high-quality and noble appearance, thanks to the closed material surface. These assemblies are used, among others, in building and industrial automation, in medical technology and in the sports & wellness industry.Company history
- 1969 Foundation of the company in Schwenningen
- 1991 Takeover of the printed circuit board production of "Mannesmann Kienzle GmbH
- 1997 Start of trading business with Asian partners
- 2004 Takeover of the printed circuit board production "Leitronic" in Riederich
- 2012 Acquisition of the neighbouring building from the property of "Osco Uhrenfabrik Schlund GmbH"
- 2017 Anniversary of 20 years of cooperation with Asian partner in Tianjin
Research and development
- 1969 Printed signs and front panels
- 1973 Production of single-sided FR4 printed circuit boards
- 1976 Production of double-sided FR4 printed circuit boards
- 1984 Production of FR4 multilayer
- 1998 Start of research on FELAM technology
- 2002 Production of single-sided glass circuit boards
- 2003 Production of single-sided metal core PCBs aka IMS (insulated metal substrate)
- 2007 Production of double-sided metal core PCBs
- 2007 Establishment of the glass manufacturing plant in Villingen-Schwenningen
- 2013 Production of IMS multilayers with up to 8 layers
- 2016 Start of research on s.mask technology
- 2018 Production of soldermask via s.mask technology
- 2010 Research cooperation with Cofidur, Paris
- 2010 funded project: Automatic optical disinfection with Furtwangen University of Applied Sciences
- 2010 funded project: Special grinding of glass contours with Furtwangen University of Applied Sciences
- 2012 funded project: FELAM THERMOCONDUCT - IMS base material
- 2016 Research cooperation with Würth Elektronik